銀含有組成物及び銀要素形成基材

Silver-containing composition and silver element forming base material

Abstract

【課題】銀含有率が高く、銀塩の分解温度未満の低温で且つ短時間の加熱でも、導電性、平坦性、密着性に優れた金属銀膜や金属銀線等の銀要素が得られる、保存安定性の高い銀含有組成物及び該組成物を用いた銀要素形成基材を提供する。 【解決手段】式(1)で表される銀化合物(A)と、式(2)で表されるアミン化合物(B)と、ウレタン結合含有ジオール(メタ)アクリレート(c1)を含む単量体組成物を重合して得た重合体(C)を含み、銀化合物(A)及びアミン化合物(B)の合計量に対する銀化合物(A)の含有割合が10〜50質量%、アミン化合物(B)の含有割合が50〜90質量%であり、重合体(C)の含有割合が、銀化合物(A)中の銀元素量100質量部に対して0.10〜0.95質量部である組成物。 【選択図】なし
PROBLEM TO BE SOLVED: To provide a silver-containing composition capable of obtaining a silver element such as a metal silver film and a metal silver wire having a high silver content and having excellent conductivity, flatness and adhesion even by heating at a low temperature less than the decomposition temperature of silver salt in a short time, and a silver element forming base material using the composition.SOLUTION: Disclosed is a composition comprising: a silver compound (A) represented by formula (1); an amine compound (B) represented by formula (2); and a polymer (C) obtained by polymerizing monomer compositions including urethane bond-containing diol(meth)acrylate(c1), and in which the containing ratio of the silver compound (A) to the total content of the silver compound (A) and the amine compound (B) is 10 to 50 mass%, the containing ratio of the amine compound (B) is 50 to 90 mass%, and the containing ratio of the polymer (C) is 0.10 to 0.95 pts.mass to 100 pts.mass of the amount of a silver element in the silver compound (A).

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